SMT Hybrid Packaging 2012

May 8 -10, 2012

Nuremberg, Germany

System Integration in Micro Electronics

SMT Hybrid Packaging is Europe´s leading event on System Integration in Micro Electronics.

Meet the industry’s leading companies for SMT-Equipment, Components and SMT-Services. With 32% foreign exhibitors, the event offers not only a wide, but also an international spectrum.
The perfect platform to get the latest information on newest trends and developments!

For more information visit: www.mesago.de/en/SMT/For_visitors/Welcome/index.htm

ONBoard Solutions offers SMT Production Solutions, Inline Printers, PCB printers, SMT assembly machines, Thermal Reflow Ovens, Wave Soldering, Conformal Coating, PCB Cleaning, Rework, Soldering, Desoldering and Rework Stations, Dispensing Units, Fume Extractor, Static Controls, DIE Bonders, Wire Bonders, Dicing Systems, Wafer Mounting System, Precision Cleaning, Lead free Solder Paste, Leaded Solder paste, Solder Wire, Flux, Epoxies, SMT Adhesives, UV Curable, Underfill, Precision Cleaners, Bonding Wire, Capilliary Tubes, Nozzles, Solder Tips, Air Showers, Pass Boxes, Transfer Hatches, Fan Filter Units, Laminar Flow Cabinets, Straddle Units, Modular Clean Rooms, disposable gloves, sterile gloves, ESD chairs, sticky mats, disposable garments, wipers, disinfectants.