Wafer Bumping Systems

If you require the capability to create bump connections, a common process is Precision Printing.

We can offer systems from Semi-Automatic Printers to Fully Automated production systems.

The technology is supplied by Milara SMT and uses their patented vibratory squeegee technology with has been approved by the company that invented the flip chip packaging company – Flip Chip Technology.

MiniTouch MTW-1 Wafer Bumping System

The MiniTouch Wafer Printer (MTW-1) is engineered to achieve the highest levels of precision and consistency in paste deposition. A self-diagnostic program for instant trouble shooting is built in to ensure maximum productivity.

Patented and proven vibration squeegee technology (certified by Flip Chip Technology)

Simplified control panel with Windows™ Professional

Fast, easy set-up and alignment

Rugged industrial control components for high reliability

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ONBoard Solutions offers SMT Production Solutions, Inline Printers, PCB printers, SMT assembly machines, Thermal Reflow Ovens, Wave Soldering, Conformal Coating, PCB Cleaning, Rework, Soldering, Desoldering and Rework Stations, Dispensing Units, Fume Extractor, Static Controls, DIE Bonders, Wire Bonders, Dicing Systems, Wafer Mounting System, Precision Cleaning, Lead free Solder Paste, Leaded Solder paste, Solder Wire, Flux, Epoxies, SMT Adhesives, UV Curable, Underfill, Precision Cleaners, Bonding Wire, Capilliary Tubes, Nozzles, Solder Tips, Air Showers, Pass Boxes, Transfer Hatches, Fan Filter Units, Laminar Flow Cabinets, Straddle Units, Modular Clean Rooms, disposable gloves, sterile gloves, ESD chairs, sticky mats, disposable garments, wipers, disinfectants.