Wafer Bumping Systems
MiniTouch MTW-1 Wafer Bumping System
The MiniTouch Wafer Printer (MTW-1) is engineered to achieve the highest levels of precision and consistency in paste deposition. A self-diagnostic program for instant trouble shooting is built in to ensure maximum productivity.
Patented and proven vibration squeegee technology (certified by Flip Chip Technology)
Simplified control panel with Windows™ Professional
Fast, easy set-up and alignment
Rugged industrial control components for high reliability




