Semi-auto DIE Bonders
Dr. Tresky AG
Designs and manufactures robust, simple to operate, high quality equipment with a broad spectrum of applications in the field of:
Hybrid Flip-Chip Photonics
SMT Die Attach MCM, COB
A precise, high quality, versatile die bonder & component placer with superior ergonomic design and programmable, high accuracy motorised Z-Drive and bonding force control.
Excellent performance and high reliability makes it ideal for small and medium production and various development applications. The automated Z-Drive with bond force control enables a high repeatability of bond parameters.
The overlapping wafer & bonding levels reduce the necessary worktable movement to a minimum. The special automatic focusing facility compensates the difference between the two microscope working levels. Various video-systems are available for alignment (e.g. Flip-Chip).
Optional equipped with wafer table and die ejector system
Excellent performance, ergonomically designed and high reliability make the T-3002-M ideal for small and medium production, runs with a cycle time of approx. 4 sec. (process depending) and various development applications.
The overlapping wafer & bonding levels reduce the necessary worktable movement to a minimum. The special automatic focusing facility compensates the difference between the two microscope working levels.
Various video-systems are available for alignment (e.g. Flip-Chip option).
The XY-wafer-table is located under the operation table. The XY-positioning knobs enable exact positioning of the dies.
The T-3202 represents a new generation of electronics assembly equipment, featuring highest possible flexibility and enabling a cost effective solution of a broad variety of applications.
The Die Attach System T-3202 is designed for both development and lower or middle productions runs.
Flexible Windows based software and new highly accurate motion control, together with the proved feature of switching from automatic to manual operation at any time provide easy teach-in programming.
Modular structure and a number of optional equipment enable optimal configuration for the user’s requirement, with the upgrade or retrofitting possibility any time.
T-4909 is a manual, high quality die bonder with
superior ergonomic design. As with all of Tresky’s products,
The T-4909 incorporates True Vertical Technology™ which
guarantees parallelism between chip and substrate at any
bond height.
Various Euthectic Hotplates are available for:
Tool Heating, Curing including Gas Controller, Hot Jet and Temperature Controllers
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