Semi-auto DIE Bonders

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TRESKY T-3002-FC3 Manual DIE Bonder

 

A precise, high quality, versatile die bonder & component placer with superior ergonomic design and programmable, high accuracy motorised Z-Drive and bonding force control.
Excellent performance and high reliability makes it ideal for small and medium production and various development applications. The automated Z-Drive with bond force control enables a high repeatability of bond parameters.

The overlapping wafer & bonding levels reduce the necessary worktable movement to a minimum. The special automatic focusing facility compensates the difference between the two microscope working levels. Various video-systems are available for alignment (e.g. Flip-Chip).

Optional equipped with wafer table and die ejector system

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