Semi-auto DIE Bonders

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TRESKY T-3002-M DIE Bonder with auto Z-Axis

 

Excellent performance, ergonomically designed and high reliability make the T-3002-M ideal for small and medium production, runs with a cycle time of approx. 4 sec. (process depending) and various development applications.

The overlapping wafer & bonding levels reduce the necessary worktable movement to a minimum. The special automatic focusing facility compensates the difference between the two microscope working levels.
Various video-systems are available for alignment (e.g. Flip-Chip option).
The XY-wafer-table is located under the operation table. The XY-positioning knobs enable exact positioning of the dies.

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