Semi-auto DIE Bonders

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Tresky T 3202 Semi-automatic DIE Bonder

 

The T-3202 represents a new generation of electronics assembly equipment, featuring highest possible flexibility and enabling a cost effective solution of a broad variety of applications.

The Die Attach System T-3202 is designed for both development and lower or middle productions runs.

Flexible Windows based software and new highly accurate motion control, together with the proved feature of switching from automatic to manual operation at any time provide easy teach-in programming.

Modular structure and a number of optional equipment enable optimal configuration for the user’s requirement, with the upgrade or retrofitting possibility any time.

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