Vacuum Soldering
We offer various solutions for vacuum soldering from R&D applications to full high volume production systems. Vacuum Soldering is targeted at applications that require…
- Fluxless soldering applications
- Higher temp soldering processess
- Voidless solder joint formation
- High mass applications
Typical applications are RF power module manufacture, Power Electronics modules, Hybrid manufacturing, Industrial micro Electonics , Military electronics etc
Systems require contact to bottom of assembly, via conduction heating and cooling plates.
The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR
lamp heated multi-purpose “cold wall” process ovens. The SRO is ideal for R&D, process development as well for low to
high volume production.
Die attachment, IGBT/DBC, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level
packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying,
wafer bump/solder ball reflow, pin fin heat sink, backing, flipchip, 3 D-CSP, diffusion bonding, CPV, thermo compression
bonding, pin fins, Hybrid assembly, MMIC die attachment, powermodules, electric vehicle controls, power solar cells
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