Wire Bonders & Testers
F&K Delvotec Semiconductor GmbH, Austria are the
technology leader for desktop bonding equipment.
Research institutes, developing laboratories and small-scale productions are using F&K Delvotec machines around the entire world market.
The Model 56XX Desktop Micro Factory been awarded Editors’ Choice Best Product Award. This 5-in-1 unit allows Wire- and Ribbon bonding as well as Pull-, Shear- and Tweezer-Testing all in one basic machine.
To download our free reference guide to learn more about Wire Bonding Technology please click here.
F&K Delvotec revolutionary Desktop Micro factory combines the best of 2 worlds: flexible as a manual bonder, it boasts the same high quality as a fully programmable automatic bonder. It bridges the gap between between production and the lab.
All bondheads including automatic Bond tester are interchanable within minutes.
The Gold Ball Bonder 5310 can process gold wires from 17,5 to 50 µm, using the bumping mode as well as the stitchbond mode.
Due to the motor driven Z-axis you work always with repeatable results. Additionally every parameter can be saved to the internal hard disk. The handling, supported by a colour display and the input with a shuttle-wheel make the programming of the machine very easy. The operator can create different kinds of loops with the manipulator system.
The 5310 manual ball bonder is the ideal choice for prototype, rework and small-scale production and complex bond-tasks.
The Wedge-Wedge Bonder 5330 can process aluminium and gold wires from 17,5 to 75 µm. Due to the new designed clamp, it’s possible to bond ribbons up to 125µm width. Due to the mechanical manipulator system the operator can create different kind of loops.
All around the world research institutes, developing laboratories and small-scale productions are using F&K Delvotec machines. With the new 5330 F&K Delvotec made the next step to leadership in manual wedge-wedge-bonding.
This 53XX BDA bondhead is the ultimate universal bondhead version. It can be used as a Ballbonder and as well as DA Wedge-Wedge- or DA Ribbon Bonder.
Deep Access area: Ballbonding 12mm, Wedge/Wedge until 20mm (with 1” Tool).
The 53xx is perfect suited for complex bond- tasks. It delivers highest quality at the most favourable price. This ma-chine is the right choiceyou’re your so-phisticated applications.