Wire Bonders

F&K Delvotec 5310 Gold Ball Bonder

The Gold Ball Bonder 5310 can process gold wires from 17,5 to 50 µm, using the bumping mode as well as the stitchbond mode.

Due to the motor driven Z-axis you work always with repeatable results. Additionally every parameter can be saved to the internal hard disk. The handling, supported by a colour display and the input with a shuttle-wheel make the programming of the machine very easy. The operator can create different kinds of loops with the manipulator system.

The 5310 manual ball bonder is the ideal choice for prototype, rework and small-scale production and complex bond-tasks.

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