Rework
Zevac AG offers top of the range rework systems – capabable to master any devices or tasks. With more than 30 years of experience Zevac is a true solutions provider in the area of:
µBGA (Micro Ball Grid Array) BQFP (Bumper Quad Flat Pack)
TQFP (Thin Quad Flat Pack) PLCC (Plastic Leaded Chip Carrier)
SMT-Connectors Flip Chips (C4)
MCM (Multi-Chip-Modules) Shieldings
TBGA (Tape Ball Grid Array) Edgeconnectors and more…..
Semi-Automated Soldering and Desoldering Station
- Controlled Placement Force
- 2000W Top Heating
- 3000 W Bottom Heating
- Split Vision System
- PCB size 300 x 400mm
- MFOV 70mm x 70mm
Semi Automatic Soldering and Desoldering Station:
- Controlled Placement Force
- 2000W Top Heating
- 3000W Bottom Heating
- Split Vision System
- PCB size 300 x ∞ mm
- MFOV 75mm x 75mm
- Side Cleaning Option
Fully automated Positioning and Soldering Station.
The ONYX 32 offers the highest degree of automation from the ONYX series. Between loading and unloading of the substrates and component feeders the process is executed fully automated. The platform can be equipped for all variations of automated hot gas rework processes:
- Hot Gass Solder
- Flip Chip Bonder
- Dispenser System












