Desoldering & Rework

Quick 2015 BGA Rework Station

Features:

IR2015 Infrared reflow soldering section of BGA rework system
Close loop control Infrared temperature sensor monitors BGA surface temperature
PL2015 Precise aligning and placing system of BGA components
Visible double-colors optical lens overlap alignment system
RPC2015 Reflow Camera to observe the melting process
IRsoft Software to record and control the process

Model No.	Quick 2015 BGA
Max Power Consumption	2800Watt
Bottom Heater	4 x 500Watt
Top Heater	180Watt
Max PCB Size	420mm x 500mm
Mac Component Size	60mm x 60mm
Infrared Temperature sensor	0 – 300 degree
-External K type sensor	optional
Weight	860g
Total Dimensions	91(L)x150(W)x75(H)mm

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